14/04/2024
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Composite materials with noble metal coated silver nanowires loaded into polymer are described. The composite materials may have resistivities of no more than about 100 Ohm-cm, or from about 100...
10/04/2024
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The present invention relates to manufacturing a multilayer graphene electrode produced from the carbonization of a polymeric matrix by irradiating an infrared laser, later modified on the surface...
24/03/2024
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Provided in the present application are a filler for a packaging material and a preparation method therefor, a magnetic plastic packaging material, and a packaged device. The filler for a...
24/03/2024
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Disclosed in the present invention are a plastic packaging module, a plastic packaging method and an electronic device. The plastic packaging module comprises a substrate, a solder resist layer is...
10/03/2024
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Provided is a conductive polymer solution from which it is possible to provide an electrolytic capacitor that has a high capacity and that exhibits low ESR characteristics. The present invention...
28/02/2024
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A találmány szerinti termék az épületszerkezetek különböz? vastagságúh?szigetelésénél, burkolásánál használható h?re lágyuló m?anyagbólfröccsöntéssel el?állított...
06/12/2023
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This copper alloy has a composition containing 0.10 mass% to 2.6 mass% of Mg, with the balance being Cu and unavoidable impurities, and has at least five edge curves, wherein the edge curve has:...
26/11/2023
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Provided are electrically conductive polymer materials that have improved long chain conductivity as well as their use in electrochemical cells and other devices. The electrically conductive...
22/10/2023
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A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer...
23/08/2023
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A display assembly, in particular for a motor vehicle dashboard, is provided with a display having a rear surface, on which a carrier is arranged; the assembly is further provided with a rear...
02/07/2023
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A semiconductor processing apparatus including: a substrate comprising a polymer material layer; and a conductive polymer coating layer that coats at least a portion of the polymer material layer...
15/05/2023
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Disclosed are a double-sided plastic packaging method for a circuit board, and a circuit board having double-sided plastic packaging. The double-sided plastic packaging method for a circuit board...
25/04/2023
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Provided herein is a combination comprising: an optically transparent substrate, a sample that comprises biological analytes, and a layer of a conductive organic polymer. In this combination, the...
25/04/2023
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Disclosed herein are electrically conductive polymer compositions comprising a polymer and a dispersant, and methods of synthesizing the polymers therein. Also disclosed herein are microelectrode...
16/04/2023
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The objective of the present invention is to provide a conductive polymer particle having, on the surface thereof, a metal layer which has excellent electrical conductivity and at the same time,...
16/04/2023
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Provided are: a method for preparing a conductive polymer dispersion in which a conductive polymer having high electrical conductivity is dispersed; and a method for manufacturing a solid...
19/03/2023
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The present disclosure relates to a method for forming a semiconductor device structure. The method includes forming a first semiconductor die and forming a second semiconductor die. The first...